The objectives of this study were to produce and modify phenolic dispersion based adhesives using technology recently developed at Forintek and to further characterize the physical properties and bonding properties of these systems for veneer and composite board applications with emphasis on faster cure speed potential. Data developed in this study indicate opportunities to improve waferboard and plywood PF adhesives in terms of color, cure rate and application properties. Further research work is recommended to improve techniques for producing and characterizing appropriate powder disperson-like formulations for wood bonding.
Further data on flow, viscosity-solids and veneer bonding at dry and 11 plus or minus 2% wood m.c. conditions are provided for heated PF powder systems. This information is intended to supplement the main report issued in March 1987.