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Effect of moisture content and its distribution throughout the mat on thick waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38553
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Physical Description
17 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Physical properties
Panels
Binders
Series Number
Forestry Canada no. 34
E-1564
Location
Ottawa, Ontario
Language
English
Abstract
The relationship of press closing time, strength properties and density profile of thick waferboard panels to mat moisture content was demonstrated in this study. Lower mat moisture contents were found to increase press clothing time but permit faster binder curing. When the distribution of mat moisture was higher in the face layers, shorter press times were achievable and a significant densification of the panel was observed.
Waferboard - Panels - Physical Properties
Moisture content
Binders
Curing
Documents
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