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Effect of moisture content and its distribution throughout the mat on thick waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38553
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Physical Description
17 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Physical properties
Panels
Binders
Series Number
Forestry Canada no. 34
E-1564
Location
Ottawa, Ontario
Language
English
Abstract
The relationship of press closing time, strength properties and density profile of thick waferboard panels to mat moisture content was demonstrated in this study. Lower mat moisture contents were found to increase press clothing time but permit faster binder curing. When the distribution of mat moisture was higher in the face layers, shorter press times were achievable and a significant densification of the panel was observed.
Waferboard - Panels - Physical Properties
Moisture content
Binders
Curing
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Regression models for moduli of rupture and elasticity of oriented waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38530
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
waferboard panels were prepared, the mean and the standard deviation of measured angles of aligned face
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Physical Description
35 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Mechanical properties
Ruptures
Panels
Series Number
Forestry Canada no. 33
E-1522
Location
Ottawa, Ontario
Language
English
Abstract
Aligned waferboard panels were prepared, the mean and the standard deviation of measured angles of aligned face wafers were carefully determined. The importance of orientation angle and angle distribution was demonstrated for board properties such as modulus of rupture and module of elasticity. Linear and non-linear regression models were studied and a number of prediction equations in terms of strength properties were tested and reported.
Modulus of Elasticity
Modulus of Rupture
Waferboard Panels - Strength Properties
Documents
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