The relationship of press closing time, strength properties and density profile of thick waferboard panels to mat moisture content was demonstrated in this study. Lower mat moisture contents were found to increase press clothing time but permit faster binder curing. When the distribution of mat moisture was higher in the face layers, shorter press times were achievable and a significant densification of the panel was observed.
Aligned waferboard panels were prepared, the mean and the standard deviation of measured angles of aligned face wafers were carefully determined. The importance of orientation angle and angle distribution was demonstrated for board properties such as modulus of rupture and module of elasticity. Linear and non-linear regression models were studied and a number of prediction equations in terms of strength properties were tested and reported.