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11 records – page 1 of 2.

Canadian waferboard properties 1979

https://library.fpinnovations.ca/en/permalink/fpipub2644
Author
Jessome, A.P.
Date
January 1979
Edition
39238
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Jessome, A.P.
Date
January 1979
Edition
39238
Material Type
Research report
Physical Description
38 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Series Number
FCC technical report 523E
E-4549
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Documents

E4549pdf

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Creep resistance, fungal resistance and dimensional characteristics of commercial and experimental waferboards : goal 2

https://library.fpinnovations.ca/en/permalink/fpipub37998
Author
Brownell, Henry H.
Date
March 1982
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Brownell, Henry H.
Date
March 1982
Material Type
Research report
Physical Description
35 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Wood decay
Waferboards
Standards
Materials
Series Number
CFS/DSS project no 11/81-82
60-57-004-2
E-19
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Standards and Specs
Creep of Materials
Waferboard - Decay - Tests
Waferboard - Properties
Documents
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E19.pdf

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Effect of accelerated aging and outdoor weathering on various properties of waferboard: a status report

https://library.fpinnovations.ca/en/permalink/fpipub38146
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Physical Description
20 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Testing
Series Number
CFS project 3/1986-87
Project no.3810010
E-512
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Durability - Testing
Waferboard - Properties
Documents
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E512.pdf

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Effect of cyclic relative humidity and high temperature on creep properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38046
Author
Alexopoulos, J.
Date
March 1985
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1985
Material Type
Research report
Physical Description
11 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 20/84-85
Project no.60-10-004
E-127
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
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E127.pdf

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Effect of high relative humidity and increased temperature on creep properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38060
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Physical Description
30 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 10/83-84
Project no.60-57-357
E-162
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
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E162.pdf

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Effect of process variables on waferboard properties : wafer geometry : waferboard improvement : technical report

https://library.fpinnovations.ca/en/permalink/fpipub38749
Contributor
Forintek Canada Corp.
Date
September 1979
Material Type
Research report
Field
Wood Manufacturing & Digitalization
. £ i3.SH .psiF TECHNICAL REPORT EFFECT OF PROCESS VARIABLES ON WAFERBOARD PROPERTIES WAFER GEOMETRY
Contributor
Forintek Canada Corp.
Date
September 1979
Material Type
Research report
Physical Description
4 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Variables
Process variables
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard
Waferboard - Properties
Waferboard - Improvement
Process Variables
Documents
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E2354.pdf

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Effect of resin content on creep and other properties of waferboard: a status report

https://library.fpinnovations.ca/en/permalink/fpipub38145
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Field
Wood Manufacturing & Digitalization
to 1.5 percent has a significant adverse effect on the following waferboard properties: thickness
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Physical Description
13 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Gluing
Series Number
CFS project 4/1986-87
Project no.3810008
E-511
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Creep
Waferboard - Gluing
Waferboard - Properties
Documents
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E511.pdf

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Effect of specimen size on the flexural properties of waferboard : goal 2

https://library.fpinnovations.ca/en/permalink/fpipub38010
Author
Shields, J.A.
Grierson, S.U.
Date
March 1982
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Shields, J.A.
Grierson, S.U.
Date
March 1982
Material Type
Research report
Physical Description
16 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Testing
Bending
Mechanical properties
Series Number
CFS/DSS project no 10/81-82
55-57-036/2
E-38
Location
Ottawa, Ontario
Language
English
Abstract
Strength - Bending - Testing
Waferboard - Properties
Documents
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E38.pdf

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Flexural properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38201
Author
Szabo, T.
Date
January 1980
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Szabo, T.
Date
January 1980
Material Type
Research report
Physical Description
20 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboard testing
Flakeboards
Waferboards
Testing
Series Number
FCC technical report TR505E
E-701
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Waferboard - Testing
Waferboard and flakeboard - Testing
Documents
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E701.pdf

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Performance of waferboard : resistance to decay and effect of load on creep properties

https://library.fpinnovations.ca/en/permalink/fpipub38066
Author
Alexopoulos, J.
Date
March 1983
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1983
Material Type
Research report
Physical Description
24 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Wood decay
Waferboards
Materials
Series Number
CFS/DSS project no 9/82-83
Project no.55-57-359
E-183
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Decay - Tests
Waferboard - Properties
Creep of Materials
Documents
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E183.pdf

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11 records – page 1 of 2.