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Canadian waferboard properties 1979

https://library.fpinnovations.ca/en/permalink/fpipub2644
Author
Jessome, A.P.
Date
January 1979
Edition
39238
Material Type
Research report
Field
Wood Manufacturing & Digitalization
to a request by CWA to prepare a summary report on waferboard properties based on the many separate reports
Author
Jessome, A.P.
Date
January 1979
Edition
39238
Material Type
Research report
Physical Description
38 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Series Number
FCC technical report 523E
E-4549
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Documents
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E4549.pdf

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Creep resistance, fungal resistance and dimensional characteristics of commercial and experimental waferboards : goal 2

https://library.fpinnovations.ca/en/permalink/fpipub37998
Author
Brownell, Henry H.
Date
March 1982
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Brownell, Henry H.
Date
March 1982
Material Type
Research report
Physical Description
35 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Wood decay
Waferboards
Standards
Materials
Series Number
CFS/DSS project no 11/81-82
60-57-004-2
E-19
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Standards and Specs
Creep of Materials
Waferboard - Decay - Tests
Waferboard - Properties
Documents
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E19.pdf

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Effect of accelerated aging and outdoor weathering on various properties of waferboard: a status report

https://library.fpinnovations.ca/en/permalink/fpipub38146
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Physical Description
20 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Testing
Series Number
CFS project 3/1986-87
Project no.3810010
E-512
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Durability - Testing
Waferboard - Properties
Documents
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E512.pdf

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Effect of cyclic relative humidity and high temperature on creep properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38046
Author
Alexopoulos, J.
Date
March 1985
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1985
Material Type
Research report
Physical Description
11 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 20/84-85
Project no.60-10-004
E-127
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
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E127.pdf

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Effect of high relative humidity and increased temperature on creep properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38060
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Physical Description
30 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 10/83-84
Project no.60-57-357
E-162
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
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E162.pdf

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Effect of process variables on waferboard properties : wafer geometry : waferboard improvement : technical report

https://library.fpinnovations.ca/en/permalink/fpipub38749
Contributor
Forintek Canada Corp.
Date
September 1979
Material Type
Research report
Field
Wood Manufacturing & Digitalization
. £ i3.SH .psiF TECHNICAL REPORT EFFECT OF PROCESS VARIABLES ON WAFERBOARD PROPERTIES WAFER GEOMETRY
Contributor
Forintek Canada Corp.
Date
September 1979
Material Type
Research report
Physical Description
4 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Variables
Process variables
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard
Waferboard - Properties
Waferboard - Improvement
Process Variables
Documents
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E2354.pdf

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Effect of resin content on creep and other properties of waferboard: a status report

https://library.fpinnovations.ca/en/permalink/fpipub38145
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Field
Wood Manufacturing & Digitalization
to 1.5 percent has a significant adverse effect on the following waferboard properties: thickness
Author
Alexopoulos, J.
Date
March 1987
Material Type
Research report
Physical Description
13 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Gluing
Series Number
CFS project 4/1986-87
Project no.3810008
E-511
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Creep
Waferboard - Gluing
Waferboard - Properties
Documents
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E511.pdf

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Effect of specimen size on the flexural properties of waferboard : goal 2

https://library.fpinnovations.ca/en/permalink/fpipub38010
Author
Shields, J.A. (Jack)
Grierson, S.U.
Date
March 1982
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Shields, J.A. (Jack)
Grierson, S.U.
Date
March 1982
Material Type
Research report
Physical Description
16 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Testing
Bending
Mechanical properties
Series Number
CFS/DSS project no 10/81-82
55-57-036/2
E-38
Location
Ottawa, Ontario
Language
English
Abstract
Strength - Bending - Testing
Waferboard - Properties
Documents
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E38.pdf

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Flexural properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38201
Author
Szabo, T.
Date
January 1980
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Szabo, T.
Date
January 1980
Material Type
Research report
Physical Description
20 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboard testing
Flakeboards
Waferboards
Testing
Series Number
FCC technical report TR505E
E-701
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Waferboard - Testing
Waferboard and flakeboard - Testing
Documents
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E701.pdf

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Performance of waferboard : resistance to decay and effect of load on creep properties

https://library.fpinnovations.ca/en/permalink/fpipub38066
Author
Alexopoulos, J.
Date
March 1983
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Alexopoulos, J.
Date
March 1983
Material Type
Research report
Physical Description
24 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Wood decay
Waferboards
Materials
Series Number
CFS/DSS project no 9/82-83
Project no.55-57-359
E-183
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Decay - Tests
Waferboard - Properties
Creep of Materials
Documents
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E183.pdf

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11 records – page 1 of 2.