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The Effect of moisture content changes on the bending and axial properties of waferboard : progress report

https://library.fpinnovations.ca/en/permalink/fpipub38407
Author
Onysko, D.M.
Date
March 1990
Material Type
Research report
Field
Sustainable Construction
Author
Onysko, D.M.
Date
March 1990
Material Type
Research report
Physical Description
5 p.
Sector
Wood Products
Field
Sustainable Construction
Research Area
Building Systems
Subject
Waferboards
Bending
Series Number
CFS project no.15
4310M034
E-1214
Location
Ottawa, Ontario
Language
English
Abstract
Moisture content - Waferboard
Waferboard - Axial properties
Waferboard - Bending properties
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Effect of specimen size on the flexural properties of waferboard : goal 2

https://library.fpinnovations.ca/en/permalink/fpipub38010
Author
Shields, J.A.
Grierson, S.U.
Date
March 1982
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Shields, J.A.
Grierson, S.U.
Date
March 1982
Material Type
Research report
Physical Description
16 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Testing
Bending
Mechanical properties
Series Number
CFS/DSS project no 10/81-82
55-57-036/2
E-38
Location
Ottawa, Ontario
Language
English
Abstract
Strength - Bending - Testing
Waferboard - Properties
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Long-term strength of Canadian commercial waferboard: 5/8-inch thick panels in bending creep data and interpretation

https://library.fpinnovations.ca/en/permalink/fpipub36917
Author
Palka, L.C.
Date
March 1989
Material Type
Research report
Field
Sustainable Construction
f o r Nominally Dry and Wet Waferboards E l a s t i c , V i s c o e l a s t i c and Viscous S t r
Author
Palka, L.C.
Date
March 1989
Material Type
Research report
Physical Description
161 p.
Sector
Wood Products
Field
Sustainable Construction
Research Area
Building Systems
Subject
Flakeboards
Waferboards
Bending
Mechanical properties
Panels
Series Number
CFS Contract 5465D008
W-648
Location
Vancouver, British Columbia
Language
English
Abstract
Summary included
Panels - Strength - Bending
Waferboard and Flakeboard - Strength
Creep - Influence of temperature
Documents
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