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Effect of moisture content and its distribution throughout the mat on thick waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38553
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Physical Description
17 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Physical properties
Panels
Binders
Series Number
Forestry Canada no. 34
E-1564
Location
Ottawa, Ontario
Language
English
Abstract
The relationship of press closing time, strength properties and density profile of thick waferboard panels to mat moisture content was demonstrated in this study. Lower mat moisture contents were found to increase press clothing time but permit faster binder curing. When the distribution of mat moisture was higher in the face layers, shorter press times were achievable and a significant densification of the panel was observed.
Waferboard - Panels - Physical Properties
Moisture content
Binders
Curing
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Producing better-quality, low-cost waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38554
Author
Shen, K.C.
Calvé, Louis R.
Date
January 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Figures 1 to 4 show the overall properties of 36 waferboards divided into three groups by three levels
Author
Shen, K.C.
Calvé, Louis R.
Date
January 1981
Material Type
Research report
Physical Description
18 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Reduction
Quality control
Qualitative analysis
Costs
Series Number
Forestry Canada no. 42
E-1565
Location
Ottawa, Ontario
Language
English
Abstract
Overall properties of poplar waferboard can be considerably upgraded by the massive use of an inexpensive resin binder derived from ammonium-based sulphite liquor (SSL). Further improvement on waferboard quality can be achieved by the combination of higher resin content and thinner wafers. Low-density waferboard also can be produced to meet CSA 0188 requirements by using aligned wafers. This inexpensive SSL binder, however, requires a longer press time and prefers a higher platen temperature to cure. A new waferboard plant, designed and built to fully exploit both technical and economical advantages of this binder system, would be ideal. For some exising waferboard plants it may be necessary to slightly modify their production line in order to adopt this new binder system. Great savings on resin cost can be realized by substituting the expensive petrochemical-based phenolic resin with the renewable and inexpensive sulphite liquor binder. Economically and technically speaking it is entirely possible to produce a new type of better waferboard at a lower cost.
Waferboard - Manufacture
Quality control
Cost reduction
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Regression models for moduli of rupture and elasticity of oriented waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38530
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Field
Wood Manufacturing & Digitalization
a t i o n of Oriented Waferboards Eor the p u rpose of modelling MOR and M 0 E , 48 experimental
Contributor
Forintek Canada Corp.
Date
March 1981
Material Type
Research report
Physical Description
35 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Mechanical properties
Ruptures
Panels
Series Number
Forestry Canada no. 33
E-1522
Location
Ottawa, Ontario
Language
English
Abstract
Aligned waferboard panels were prepared, the mean and the standard deviation of measured angles of aligned face wafers were carefully determined. The importance of orientation angle and angle distribution was demonstrated for board properties such as modulus of rupture and module of elasticity. Linear and non-linear regression models were studied and a number of prediction equations in terms of strength properties were tested and reported.
Modulus of Elasticity
Modulus of Rupture
Waferboard Panels - Strength Properties
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