Skip header and navigation

6 records – page 1 of 1.

Canadian waferboard symposium: 1982

https://library.fpinnovations.ca/en/permalink/fpipub1690
Contributor
Forintek Canada Corp.
Date
January 1984
Edition
38204
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Contributor
Forintek Canada Corp.
Date
January 1984
Edition
38204
Material Type
Research report
Physical Description
273 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Performance
Canada
Series Number
Special Publication SP-508E
E-705
Location
Ottawa, Ontario
Language
English
ISBN
ISBN-0-86488-508-1
Abstract
Proceedings of the Canadian waferboard symposium. Waferboard can be regarded as a successful structural panel in the recent history of wood products. To recognize this, the Waferboard symposium series concept was first initiated in 1980. The second Waferboeard symposium - held from June 1- 3 1982 - based its program on a critical review of the first meeting. The sessions covered the following subjects: Process and manufacture; Product standard and markets; Adhesive technology; Product performance; Resource potential; Equipment up-date.
Waferboard - Congresses
Composite Board
Waferboard - Manufacture
Waferboard - Structural Performance
Forintek Canada Corp. - Publications
Documents
Less detail

Determination of powdered resin distribution and its effect on waferboard properties

https://library.fpinnovations.ca/en/permalink/fpipub5471
Author
Kasper, J.B.
Pickles, K.J.
Date
January 1984
Edition
37054
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Kasper, J.B.
Pickles, K.J.
Date
January 1984
Edition
37054
Material Type
Research report
Physical Description
15 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Flakeboards
Waferboards
Series Number
W-264
Location
Vancouver, British Columbia
Language
English
Abstract
Waferboard and flakeboard
Documents
Less detail

Durability ranking of adhesives for waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38061
Author
Brownell, Henry H.
Date
March 1984
Material Type
Research report
Field
Wood Manufacturing & Digitalization
Author
Brownell, Henry H.
Date
March 1984
Material Type
Research report
Physical Description
70 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Materials
Gluing
Bonding
Series Number
CFS/DSS project no 12/83-84
Project no.60-57-365
E-163
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Gluing
Composite materials - Bonding
Documents
Less detail

Effect of high relative humidity and increased temperature on creep properties of waferboard

https://library.fpinnovations.ca/en/permalink/fpipub38060
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Field
Wood Manufacturing & Digitalization
commercially-produced, 11.1-mm poplar waferboards to determine the effect of high relative humidity (90
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Physical Description
30 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 10/83-84
Project no.60-57-357
E-162
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
Less detail

Exterior weathering of panel products

https://library.fpinnovations.ca/en/permalink/fpipub38078
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Field
Wood Manufacturing & Digitalization
with the large length-to-width wafer size, in aligned long wafer waferboards is clearly evident
Author
Alexopoulos, J.
Date
March 1984
Material Type
Research report
Physical Description
19 p.
Sector
Wood Products
Field
Wood Manufacturing & Digitalization
Research Area
Advanced Wood Manufacturing
Subject
Waferboards
Series Number
CFS/DSS project no 11/83-84
Project no.60-57-403
E-233
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Durability
Documents
Less detail

Technical summary : protective treatments for waferboard - a brief review

https://library.fpinnovations.ca/en/permalink/fpipub41696
Author
Desai, Roman L.
Date
March 1984
Material Type
Research report
Field
Sustainable Construction
marginal decay hazard. However, projected demand for waferboards includes applications where severe decay
Author
Desai, Roman L.
Date
March 1984
Material Type
Research report
Physical Description
17 p.
Sector
Wood Products
Field
Sustainable Construction
Research Area
Advanced Wood Materials
Subject
Waferboards
Veneer
Treatment
Review
Panels
Location
Ottawa, Ontario
Language
English
Abstract
The susceptibility of non-veneered composite panel products to decay is greater than solid timber when exposed to high moisture contents and severe decay hazard conditions. Preservative chemicals incorporated into these products at various stages of manufacture generally improve the decay resistance of these materials but certain strength properties, especially internal bond, are adversely affected. It appears from the literature survey that treatment of the composite panel products with ACA type preservative system could provide adequate protection with acceptable loss in the strength properties of the panels.
Waferboard
Non-Veneered Composite Panel
Protective Treatments
Review
Documents
Less detail

6 records – page 1 of 1.