This report presents the results of a pilot study of the equilibrium moisture content and tensile strength of 20.5 mm thick Canadian Softwood Plywood and 15.9 mm thick waferboard exposed to a range of climatic conditions. Plywood and waferboard were conditioned until they reached constant weight at 20 C/65%RH and 5 C/90%RH. In addition some of the plywood and waferboard test specimens conditioned at high humidity subsequently were moved to a 20 C/65%RH atmosphere where they remained until an equilibrium moisture content had been achieved. A fourth group of plywood and waferboard specimens were kept at ambient conditions in the laboratory. Additional groups of plywood specimens were conditioned at 20 C/50%RH, 20 C/80%RH and also reconditioned from wet to 20 C/50%RH. Density, moisture content and tensile strength of all specimens were determined after they had reached equilibrium moisture content. The results indicate that there can be large differences in the equilibrium moisture content of wood-based panel products. The results also indicate a strong moisture dependency for the tensile strength of waferboard. No clear trend for the tensile strength of plywood in relation to moisture content could be established by this study.