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Effect of high relative humidity and increased temperature on creep properties of waferboard
https://library.fpinnovations.ca/en/permalink/fpipub38060
Author
Alexopoulos James
Date
March 1984
Material Type
Research report
Field
=Wood Manufacturing
Author
Alexopoulos James
Date
March 1984
Material Type
Research report
Physical Description
30 p.
Sector
Wood Products
Field
=Wood Manufacturing
Research Area
Advanced Manufacturing Wood Products
Subject
Waferboard properties
Waferboards
Materials
Series Number
CFS/DSS project no 10/83-84
Project no.60-57-357
E-162
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Properties
Creep of Materials
Documents
E162.pdf
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