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Effect of resin content on creep and other properties of waferboard: a status report
https://library.fpinnovations.ca/en/permalink/fpipub38145
Author
Alexopoulos James
Date
March 1987
Material Type
Research report
Field
=Wood Manufacturing
Author
Alexopoulos James
Date
March 1987
Material Type
Research report
Physical Description
13 p.
Sector
Wood Products
Field
=Wood Manufacturing
Research Area
Advanced Manufacturing Wood Products
Subject
Waferboard properties
Waferboards
Gluing
Series Number
CFS project 4/1986-87
Project no.3810008
E-511
Location
Ottawa, Ontario
Language
English
Abstract
Waferboard - Creep
Waferboard - Gluing
Waferboard - Properties
Documents
E511.pdf
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