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Effect of moisture content and its distribution throughout the mat on thick waferboard

https://library.fpinnovations.ca/fr/permalink/fpipub38553
Collaborateur
Forintek Canada Corp.
Date
March 1981
Genre du document
Research report
Domaine
Wood Manufacturing & Digitalization
Collaborateur
Forintek Canada Corp.
Date
March 1981
Genre du document
Research report
Description physique
17 p.
Secteur
Wood Products
Domaine
Wood Manufacturing & Digitalization
Champ de recherche
Advanced Wood Manufacturing
Sujet
Waferboards
Physical properties
Panels
Binders
Série
Forestry Canada no. 34
E-1564
Localisation
Ottawa, Ontario
Langue
English
Résumé
The relationship of press closing time, strength properties and density profile of thick waferboard panels to mat moisture content was demonstrated in this study. Lower mat moisture contents were found to increase press clothing time but permit faster binder curing. When the distribution of mat moisture was higher in the face layers, shorter press times were achievable and a significant densification of the panel was observed.
Waferboard - Panels - Physical Properties
Moisture content
Binders
Curing
Documents
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