Engineered wood flooring (EWF) is gaining in popularity since it appeared in Europe in the 70’s. 40% of the wood flooring installed in the USA is EWF and 75% are EWF in Europe. In layered wood composites such as engineered wood flooring, dimensional stability is of primary importance. The non-homogeneous adsorption or desorption of moisture by the composite may induce cupping, thus decreasing product value. These products were developed by the industry with the result that knowledge on the product and its behaviour is very limited. The objective of this study is to develop a finite element model of the hygromechanical cupping induced by moisture desorption in layered wood composites. The model is based on two sets of equations, 1) the three-dimensional equation of unsteady state moisture diffusion, and 2) the three-dimensional equations of elasticity including an orthotropic Hooke’s law, which takes into account the shrinkage, and swelling of each layer. The model was used to assess 34 different constructions. Results may be used as guideline in the design of new engineered wood flooring construction.