Long-term strength of Canadian commercial waferboard: 5/8-inch thick panels in bending - creep and creep-rupture data and interpretation - final project report
Lack of easy-to-use technical information about their long-term behavior could become a serious barrier to expanded use of waferboard panels. In cooperation with the Structural Board Association, the American Plywood Association and the U.S. Forest Products Laboratory in Madison, a long-term experimental plan was devised to provide missing information on the effect of different loading and selected environmental conditions on the static, creep and creep-rupture behavior of waferboard panels in Canada, plywood and oriented strandboard in the U.S., subjected to third-point bending. The broad data base collected, supplemented by other related information, provides a good basis for a detailed and unified evaluation of analytical models to predict creep and creep-rupture behavior. The same data base would also allow estimation of the code factors needed for reliable design of individual waferboard panels subjected to flat-wise bending.