This second status report describes the effects of 1 year exterior weathering at the Ottawa site and three accelerated aging tests on thickness, bending properties, internal bond strength, surface hardness, and nail withdrawal resistance of small specimens of two commercial waferboards. Following 1 year exterior weathering, all but two properties of random short wafer waferboards were adversely affected to a greater extent than aligned long wafer specimens. Thickness change and internal bond strength retention were more or less equal for the two waferboards. Relative to 1 year exterior weathering, accelerated aging was more severe in all cases except modulus of rupture following the AFNOR V 313 test and modulus of elasticity following both the AFNOR V 313 test and the ASTM 6-cycle test. Of the three accelerated aging tests studied, the AFNOR V 313 test was the least severe followed by the ASTM 6-cycle test and the CSA 2-hour boil, the most severe test. A second outdoor test site was set up in Saskatoon, Saskatchewan and similar waferboards were mounted for exposure.